3 Trademark Results found for "sFAB"

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sFAB*

*FAB

Details	Status	Class/Description
sFAB FUJI CORPORATION UK00801521878	Registered	Automated small parts assembly equipment; automated assembly machinery... Class 007 Class 007 Machinery Products Automated small parts assembly equipment; automated assembly machinery for fuel cells, solar cells and other secondary batteries; automated assembly equipment for telecommunication machines and apparatus; automated assembly equipment for electronic machines and apparatus; automated assembly equipment for photographic machines and apparatus; automated assembly equipment for cinematographic machines and apparatus; automated assembly equipment for optical machines and apparatus; electronic circuit card assembly equipment; electronic circuit assembly equipment; automated assembly equipment for game machines and apparatus; automated assembly equipment for AC motors and DC motors; automated assembly equipment for power distribution or control machines and apparatus; automated assembly equipment for metalworking machines and tools; automated assembly equipment for medical apparatus and instruments.
sFAB-a FUJI CORPORATION UK00801535002	Registered	Automatic electronic parts mounting machines for automatically mountin... Class 007 Class 007 Machinery Products Automatic electronic parts mounting machines for automatically mounting electronic parts such as IC chips on printed circuit boards; automatic electronic parts insertion machines for putting electronic parts in printed circuit boards; printed board screen printers; dispensers for printed boards; adhesive curing equipment for printed boards; soldering machines for printed boards; semiconductor manufacturing machines; electronic parts feeders for semiconductor manufacturing apparatus; automated mounting devices for use in feeders for electronic components; automated conveyors for use in feeders for electronic components; metalworking machine tools; metalworking machines; turning centers; lathes [machine tool]; machining centers; plasma surface treatment apparatus for semiconductor substrates; plasma cleaning apparatus for semiconductor substrates; surface adhesion improving treatment machines using plasma for semiconductor substrates, metal, glass, rubber, synthetic resin, semiconductor electronic parts, eyeglass lenses, optical instrument parts, automobile parts, cutting tools and solar cells; hydrophilic nature improving treatment machines using plasma for semiconductor substrates, metal, glass, rubber, synthetic resin, semiconductor electronic parts, eyeglass lenses, optical instrument parts, automobile parts, cutting tools and solar cells; plasma cleaning machines for semiconductor substrates, metal, glass, rubber, synthetic resin, semiconductor electronic parts, eyeglass lenses, optical instrument parts, automobile parts, cutting tools and solar cells; oxide film removing machines using plasma for semiconductor substrates, metal, semiconductor electronic parts and metallic automobile parts; plasma etching machines for semiconductor materials; residue removing machines using plasma for use in semiconductor substrate manufacturing process; metallic surface hardening treatment machines using plasma for improving abrasion resistance of cutting tools; surface finishing treatment machines using plasma for easier forming of prosthesis coating over the ceramic material surfaces of junctions of artificial bones or joints during their manufacturing process; automated small parts assembly equipment; automated assembly machinery for fuel cells, solar cells and other secondary batteries; automated assembly instruments for metallic parts, automobile parts, electric parts and other mechanical parts; electronic circuit card assembly equipment; electronic circuit assembly equipment; automated assembly equipment for medical instruments; industrial robots; automated storage and retrieval warehouses, namely, automated machines for retrieving items in storage; AC motors and DC motors not including those for land vehicles but including parts for any AC motors and DC motors; parts and accessories of industrial robots or automated storage and retrieval warehouse; robot parts and accessories for assembly, welding, processing or transfer; inspection robots for electric/electronic parts manufacturing process.
SFAB-α FUJI CORPORATION UK00801543754	Registered	Automatic electronic parts mounting machines for automatically mountin... Class 007 Class 007 Machinery Products Automatic electronic parts mounting machines for automatically mounting electronic parts such as IC chips on printed circuit boards; automatic electronic parts insertion machines for putting electronic parts in printed circuit boards; printed board screen printers; dispensers for printed boards; adhesive curing equipment for printed boards; soldering machines for printed boards; semiconductor manufacturing machines; electronic parts feeders for semiconductor manufacturing apparatus; automated mounting devices for use in feeders for electronic components; automated conveyors for use in feeders for electronic components; metalworking machines and tools; metalworking machines; turning centers; lathes [machine tool]; machining centers; plasma surface treatment apparatus for semiconductor substrates; plasma cleaning apparatus for semiconductor substrates; surface adhesion improving treatment machines using plasma for semiconductor substrates, metal, glass, rubber, synthetic resin, semiconductor electronic parts, eyeglass lenses, optical instrument parts, automobile parts, cutting tools and solar cells; hydrophilic nature improving treatment machines using plasma for semiconductor substrates, metal, glass, rubber, synthetic resin, semiconductor electronic parts, eyeglass lenses, optical instrument parts, automobile parts, cutting tools and solar cells; plasma cleaning machines for semiconductor substrates, metal, glass, rubber, synthetic resin, semiconductor electronic parts, eyeglass lenses, optical instrument parts, automobile parts, cutting tools and solar cells; oxide film removal machines for semiconductor substrates, metals, semiconductor electronic components, and metallic automobile parts using plasma; plasma etching machines for semiconductor materials; residue removing machines using plasma for use in semiconductor substrate manufacturing process; metallic surface hardening treatment machines using plasma for improving abrasion resistance of cutting tools; surface processing and treatment machines for the treatment of ceramic material using plasma for processing so as to facilitate easier forming of a prosthesis coating over the ceramic material surfaces of junctions of artificial bones or joints during their manufacturing process; automated small parts assembly machines; automated assembly machinery for fuel cells, solar cells and other secondary batteries; automated assembly machines for metallic parts, automobile parts, electric parts and other mechanical parts; machines for use in electronic circuit board assembly; electronic circuit assembly equipment; automated assembly equipment for medical instruments; industrial robots; automated storage and retrieval warehouse; AC motors and DC motors not including those for land vehicles but including parts for any AC motors and DC motors; parts and accessories of industrial robots or automated storage and retrieval warehouse; robot parts and accessories for assembly, welding, processing or transfer; industry robots for electric/electronic parts manufacturing process.

Registered

sFAB

FUJI CORPORATION

007

Automated small parts assembly equipment; automated assembly machinery...

Registered

sFAB-a

FUJI CORPORATION

007

Class 007

Machinery Products

Automatic electronic parts mounting machines for automatically mounting electronic parts such as IC chips on printed circuit boards; automatic electronic parts insertion machines for putting electronic parts in printed circuit boards; printed board screen printers; dispensers for printed boards; adhesive curing equipment for printed boards; soldering machines for printed boards; semiconductor manufacturing machines; electronic parts feeders for semiconductor manufacturing apparatus; automated mounting devices for use in feeders for electronic components; automated conveyors for use in feeders for electronic components; metalworking machine tools; metalworking machines; turning centers; lathes [machine tool]; machining centers; plasma surface treatment apparatus for semiconductor substrates; plasma cleaning apparatus for semiconductor substrates; surface adhesion improving treatment machines using plasma for semiconductor substrates, metal, glass, rubber, synthetic resin, semiconductor electronic parts, eyeglass lenses, optical instrument parts, automobile parts, cutting tools and solar cells; hydrophilic nature improving treatment machines using plasma for semiconductor substrates, metal, glass, rubber, synthetic resin, semiconductor electronic parts, eyeglass lenses, optical instrument parts, automobile parts, cutting tools and solar cells; plasma cleaning machines for semiconductor substrates, metal, glass, rubber, synthetic resin, semiconductor electronic parts, eyeglass lenses, optical instrument parts, automobile parts, cutting tools and solar cells; oxide film removing machines using plasma for semiconductor substrates, metal, semiconductor electronic parts and metallic automobile parts; plasma etching machines for semiconductor materials; residue removing machines using plasma for use in semiconductor substrate manufacturing process; metallic surface hardening treatment machines using plasma for improving abrasion resistance of cutting tools; surface finishing treatment machines using plasma for easier forming of prosthesis coating over the ceramic material surfaces of junctions of artificial bones or joints during their manufacturing process; automated small parts assembly equipment; automated assembly machinery for fuel cells, solar cells and other secondary batteries; automated assembly instruments for metallic parts, automobile parts, electric parts and other mechanical parts; electronic circuit card assembly equipment; electronic circuit assembly equipment; automated assembly equipment for medical instruments; industrial robots; automated storage and retrieval warehouses, namely, automated machines for retrieving items in storage; AC motors and DC motors not including those for land vehicles but including parts for any AC motors and DC motors; parts and accessories of industrial robots or automated storage and retrieval warehouse; robot parts and accessories for assembly, welding, processing or transfer; inspection robots for electric/electronic parts manufacturing process.

Automatic electronic parts mounting machines for automatically mountin...

Registered

SFAB-α

FUJI CORPORATION

007

Class 007

Machinery Products

Automatic electronic parts mounting machines for automatically mounting electronic parts such as IC chips on printed circuit boards; automatic electronic parts insertion machines for putting electronic parts in printed circuit boards; printed board screen printers; dispensers for printed boards; adhesive curing equipment for printed boards; soldering machines for printed boards; semiconductor manufacturing machines; electronic parts feeders for semiconductor manufacturing apparatus; automated mounting devices for use in feeders for electronic components; automated conveyors for use in feeders for electronic components; metalworking machines and tools; metalworking machines; turning centers; lathes [machine tool]; machining centers; plasma surface treatment apparatus for semiconductor substrates; plasma cleaning apparatus for semiconductor substrates; surface adhesion improving treatment machines using plasma for semiconductor substrates, metal, glass, rubber, synthetic resin, semiconductor electronic parts, eyeglass lenses, optical instrument parts, automobile parts, cutting tools and solar cells; hydrophilic nature improving treatment machines using plasma for semiconductor substrates, metal, glass, rubber, synthetic resin, semiconductor electronic parts, eyeglass lenses, optical instrument parts, automobile parts, cutting tools and solar cells; plasma cleaning machines for semiconductor substrates, metal, glass, rubber, synthetic resin, semiconductor electronic parts, eyeglass lenses, optical instrument parts, automobile parts, cutting tools and solar cells; oxide film removal machines for semiconductor substrates, metals, semiconductor electronic components, and metallic automobile parts using plasma; plasma etching machines for semiconductor materials; residue removing machines using plasma for use in semiconductor substrate manufacturing process; metallic surface hardening treatment machines using plasma for improving abrasion resistance of cutting tools; surface processing and treatment machines for the treatment of ceramic material using plasma for processing so as to facilitate easier forming of a prosthesis coating over the ceramic material surfaces of junctions of artificial bones or joints during their manufacturing process; automated small parts assembly machines; automated assembly machinery for fuel cells, solar cells and other secondary batteries; automated assembly machines for metallic parts, automobile parts, electric parts and other mechanical parts; machines for use in electronic circuit board assembly; electronic circuit assembly equipment; automated assembly equipment for medical instruments; industrial robots; automated storage and retrieval warehouse; AC motors and DC motors not including those for land vehicles but including parts for any AC motors and DC motors; parts and accessories of industrial robots or automated storage and retrieval warehouse; robot parts and accessories for assembly, welding, processing or transfer; industry robots for electric/electronic parts manufacturing process.

Automatic electronic parts mounting machines for automatically mountin...

Owners

Fuji corporation (3)

Categories

Class 7 (3)

Attorney

Sipara limited (2)

Unius patent attorneys office (1)

Correspondents

Rochester house (2)

First shin-osaka mt bldg., 2nd floor, 5-13-9 nishinakajima, yodogawa-ku, osaka-shi osaka 532-0011 (1)

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