on 8 Oct 2004
Last Applicant/ Owned by
UTAC Headquarters Pte. Ltd
22 Ang Mo Kio Industrial Park 2
Singapore, , 569506
Serial Number
UK00904067146 filed on 8th Oct 2004
Registration Number
UK00904067146 registered on
14th Jun 2006
Correspondent Information
Lewis Silkin LLP
Arbor, 255 Blackfriars Road
London,
SE1 9AX
Electrical and electronic components; semi-conductors, semi-conductor chips; integrated circuits, integrated packages and integrated circuit chips; parts and fittings for all the aforesaid goods; central processing units; computer components; computers; computer input and output devices; computer registers; computer systems; data memories; electronic circuit boards; equipment for testing and programming integrated circuits; integrated circuits; integrated circuit memories; memory boards; microcomputers; microcontrollers; microprocessors; minicomputers; modems; peripheral memory systems; recorded computer programs; cash registers; processing equipment; processors; semi-conductor chips; work stations; semi-conductor memories; storage devices; video processor boards.
Custom assembling of materials for others; custom assembling and packaging (encapsulation) of electrical and electronic components, semi-conductors, semi-conductor chips, integrated circuits, integrated packages and integrated circuit chips; custom assembling of semi-conductors, semi-conductor chips and integrated circuits; providing information, advice and consultation in relation to all the aforesaid services; research and development services relating to the aforesaid services.
Engineering testing services; engineering consultancy services relating to testing; software engineering services; testing, analysis, wafer probe, wafer sort [probing and testing], final testing and design of electrical and electronic components, semi-conductors, semi-conductor chips, integrated circuits, integrated packages and integrated circuit chips; provision of testing facilities for electrical and electronic components, semi-conductors, semi-conductor chips, integrated circuits, integrated packages and integrated circuit chips; research and development services relating to the aforesaid services; engineering consultancy services relating to packaging; information, advice and consultation in relation to the aforesaid services; research and development services relating to custom assembling of materials for others, custom assembling and packaging (encapsulation) of electrical and electronic components, semi-conductors, semi-conductor chips, integrated circuits, integrated packages and integrated circuit chips, custom assembling of semi-conductors, semi-conductor chips and integrated circuits, providing information, advice and consultation in relation to all the aforesaid services; research and development services relating to the aforesaid services.
UK00904067146
Word
Individual