Class [40]
Treatment & Processing of Materials Services
Assembly and custom manufacture of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices for others.
Class [42]
Computer & Software Services & Scientific Services
Software engineering services; engineering testing services relating to the assembly, packaging, encasing, and design of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices; engineering consulting services relating to testing, assembly, packaging encasing analysis, wafer probe, wafer sort, wafer bumping, and design of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices; providing facilities and equipment for others to test electrical and electronic components, electrical semi-conductors, and semi-conductor chips or devices; back-end turn key services, namely, test development services, wafer sort services, final test services, and packaging design services for electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices; providing scientific and technical information, advice and consultation relating to product design, product development, product engineering, product testing and product manufacturing of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices.
