on 17 Jun 2014
Last Applicant/ Owned by
LINTEC KABUSHIKI KAISHA (also trading as LINTEC CORPORATION)
23-23, Honcho, Itabashi-ku
Tokyo, , 173-0001
Serial Number
UK00913004346 filed on 17th Jun 2014
Registration Number
UK00913004346 registered on
18th Dec 2014
Correspondent Information
ip21 Limited
Central Formalities Department, Suite 2, The Old Dairy, Elm Farm Business Park, Wymondham, Norwich
Norfolk,
NR18 0SW
Metal working machinery and appliances; Semiconductor manufacturing machines and systems; Machines for dicing semiconductor wafers into chips by means of blade, by means of laser, or by other means; Grinding machines, in particular for use in semiconductor manufacturing process; UV irradiation machines, electron beam irradiation machines, and other energy line irradiation machines, all being for use in semiconductor manufacturing process; Machines for adhering surface protection tapes, machines for adhering backside protection tape, both being for use in semiconductor manufacturing process; Machines for releasing surface protection tape, machines for releasing backside protection tape, both being for use in semiconductor manufacturing process; Machines for issuing and adhering, and for writing bar code label and radio frequency identification (RFID) label, all being for use in semiconductor manufacturing process; Metal working machinery and appliances made up of cutting machines for semiconductor wafers and the like, tape adhering machines, grinding machines, transporting machines, tape replacing machines; Semiconductor wafer processing machines and parts thereof; Semiconductor wafer washing machines; Feeding machines; transferring machines; Feeding machines, transferring machines, and storing machines, all for semiconductor wafers; Machines for exchanging wafers among semiconductor wafer containers; Heating machines, pressurizing machines for processing semiconductor wafers; Frames for use in semiconductor wafer processing steps [fitting and auxiliary parts for wafers]; Storing containers, transferring containers, and transporting containers, all for use with frames to be used in processing semiconductor wafers; Cutting machines, and punching machines, both particularly being for use in semiconductor wafer processing tapes; Machines for picking up diced semiconductor chips; Printing/book making machines and appliances; Wrapping machines and appliances; Automatic labeling machines and appliances [other than for office use]; Labeling machines and appliances [other than for office use]; Label making machines [other than for office use]; Laminators [machines] other than for office use; Delaminators [machines] other than for office use; Tape laminators and tape removers [machines]; Bar code labelers.
Machines for reading bar code label and radio frequency identification (RFID) label, all being for use in semiconductor manufacturing process.
UK00913004346
Figurative
Individual