Class [1]
Chemical Products
Wave solder fluxes, die attach materials and adhesives, namely, fluxes, metallic, polymeric and die attach materials and chemicals, chemical fluxes and adhesives used in light emitting diode and organic light emitting diode packaging and assembly, and power driver and control systems for light emitting diode and organic light emitting diode systems; die attach paste fluxes and light emitting diode and power driver packaging materials, namely, solder spheres used for chemical and metal based solder bumping, ball grid arrays and interconnect applications for light emitting diode and organic light emitting diode and related power driver and control system device packaging; chemical and metal based wafer bumping pastes, hermetic sealing materials, and other metal and polymer-metal and polymer-ceramic composite materials used in light emitting diode wafer bumping and other metal and polymer-metal and polymer-ceramic composite materials used in hermetically sealing light emitting diode and organic light emitting diode products; protective chemical coatings, namely, conformal coatings used to protect light emitting diode, organic light emitting diode and electronic circuits, optical chemicals and materials, namely, reflective materials, namely, reflective and absorptive solder masks and metallic and polymeric reflector materials used in light emitting diode and organic light emitting diode assemblies, high refractive index optical polymers and adhesives, namely, epoxies, silicones and related materials, polymer and ceramic composite encapsulants and optical adhesives, namely, epoxies, silicones and transparent oxide/ceramic materials that enable enhanced light extraction from light emitting diode and organic devices, energy conversion chemicals and materials, namely, phosphors and semiconducting materials, namely, yags, nitrides and oxynitrides, silicates, sulfides, thiogallates, glass-ceramic phosphors, tungstates, molybdates, quantum-dots and nano-phosphors, transparent conductive materials, namely, metal oxides and ito [Indium tin Oxide] replacement materials such as graphene, transparent conductive polymer-metal composite materials, electroplating and electroless plating chemicals, namely, copper, tin, nickel, and silver based chemistries including brighteners and levelers, and chemicals for plating on plastics, etchants for use in light emitting diode and organic light emitting diode and power driver and control systems manufacturing, chemical coatings used in manufacture of light emitting diode and organic light emitting diode and power driver and control systems products.
