LINTEC ADVANCED TECHNOLOGIES
metalworking machines and tools; semiconductor manufacturing machines and systems; blade dicing machines, laser dicing machines and other dicing machi Read More
Classification Information
Class [7]
Machinery Products
Metalworking machines and tools; semiconductor manufacturing machines and systems; blade dicing machines, laser dicing machines and other dicing machines for cutting semiconductor wafers into chips; grinding machines for use in the semiconductor manufacturing process; ultraviolet irradiation machines, electron beam irradiation machines and other energy ray irradiation machines for use in the semiconductor manufacturing process; surface protection tape adhering machines and underside protection tape adhering machines for use in the semiconductor manufacturing process; surface protection tape release machines and underside protection tape release machines for use in the semiconductor manufacturing process; issuing and adhering machines, and writing machines for bar code labels and RFID labels for use in the semiconductor manufacturing process; metalworking machinery apparatus consisting of cutting machines, tape adhering machines, grinding machines, conveying machines and tape re-adhering machines, all for use in the manufacture of semiconductor wafers; semiconductor wafer processing machines and parts thereof; feeder machines, conveyer machines, storage machines for use in the manufacture of semiconductor wafers; machines for exchanging between semiconductor wafer containers; heating machines and pressure machines for semiconductor wafer processing; frame for semiconductor wafer processing operations; cutting apparatus and punching apparatus for tape used in semiconductor wafer processing; pick-up machines for separated chips for semiconductor use; printing or bookbinding machines and apparatus; packaging or wrapping machines and apparatus; automatic label adhering machines; plastic processing machines and apparatus; adhesive tape dispensing machines; mixing equipment for commercial use; machines and apparatus for adhesion processing of films and sheets for optical disks; machines and apparatus for adhesion processing of films and sheets for displays of televisions, personal computers, and all types of touch panel; machines and apparatus for adhesion processing of films and sheets; machines and apparatus for film and sheet release.
Class [9]
Computer & Software Products & Electrical & Scientific Products
Barcode printers; thermal wax transfer printers; laser printers; ink-jet printers; thermal printers; printers; semi-conductor elements; electronic circuits [not including those recorded with computer programs]; optical machines and apparatus; measuring or testing machines and instruments; telecommunication machines and apparatus; reading machines for bar code labels and RFID labels for use in the semiconductor manufacturing process.
Class [16]
Paper Goods and Printed Material
Addressing machines; ink ribbons; envelope sealing machines for offices; dust free paper; adhesive coated paper; paper; adhesive labels [not of textile]; heat-sensitive adhesive labels; heat-sensitive printing labels; adhesive tape for stationery use; barcode labels, RFID labels, for distribution management; barcode labels, RFID labels, for production management; dust free notepaper; stationery.
Class [17]
Rubber Products
Semi-processed plastics; plastic film coated with adhesive (not for wrapping); adhesive tape for use in semiconductor processing; adhesive tape for use in semiconductor fastening; tape for semiconductor wafer processing; adhesive tape for bonding and laminating chips for semiconductor use; adhesive tape used in the manufacturing process of ceramic condensers; semiconductor chip back-surface protective tape; double-sided adhesive films and sheets for industrial purposes; adhesive films and sheets for protection; electrical insulating materials; plastic film for farming purposes; plastic film, not for wrapping; plastic materials in the form of sheets (semi-finished products); rubber [raw or semi-worked]; adhesive tape for processing of electronic parts; plastic film coated with release agent or mold-release preparation; roll or sheet protective plastic release film for adhesive tape for use in the processing of polarizing plates, the fastening of optical film, protective film; roll or sheet plastic release film for use in the process of manufacturing multi-layer substrates (laminated substrates) and for use in the process of manufacturing of ceramic condensers; roll or sheet protective plastic release film for bonding agent for use in printed circuit boards.
Class [20]
Furniture Products
Non-metallic containers for storage, non-metallic containers for conveying, and non-metallic containers for transportation of semiconductor wafers; plastic containers for storage, plastic containers for conveying, and plastic containers for transportation of semiconductor wafers; non-metallic containers for storage, non-metallic containers for conveying, and non-metallic containers for transportation of frames for semiconductor wafers processing operation; plastic containers for storage, plastic containers for conveying, and plastic containers for transportation of frames for semiconductor wafers processing operation.
