Class [40]
Treatment & Processing of Materials Services
Semiconductor and integrated circuit foundry; Custom manufacturing and assembling services relating to semi-conductor parts and integrated circuits; Semiconductor foundry; Processing of semiconductors; Custom assembling of circuit board and semiconductor; Processing of parts for semiconductor manufacturing; Processing of semiconductor elements; Processing of semiconductor wafers; Processing of micro-display, including silicon-based liquid crystal micro-display, for others; Processing of smart card and SIM card for others; Custom making of wafers, semi-conductors, integrated circuits, including custom making of application-specific integrated circuit, logic chip, mixed signal chip and memory chip; Processing of wafers, semi-conductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; Processing, assembling and packaging services of wafers as part of semiconductor manufacturing processes, Processing, assembling and packaging services of semi-conductors as part of semiconductor manufacturing processes, Processing, assembling and packaging services of integrated circuits, as part of semiconductor manufacturing processes, for others; Cutting, forming, and etching process of semi-conductors and integrated circuits for others.
