FORTIBOND

Class [1]
Chemical Products

Printable pastes for wafer bonding; Printable, dispensable or pin transferable pastes for attachment of semiconductor die (either with flip chip wafer bumping or wire bonded tipe), onto a variety of substrates, and hermetic/near hermetic packaging; Transferable films for wafer-to-wafer bonding, attachment of semiconductor die (either flip chip or wire bonded), onto a variety of substrates, and hermetic/near hermetic packaging; printable pastes for attachment of semiconductor packages of various types onto a variety of substrates; printable or dispensable or jettable pastes and inks for production of electrical and thermal interconnect lines and patterns, circuitry, pads; Printable pastes for via-fill applications; pastes and films for reflective layer printing or transfer.