on 20 Dec 2019
Last Applicant/ Owned by
CMC Materials LLC
870 N. Commons Drive
Aurora,, Illinois, 60504
Serial Number
UK00918170462 filed on 20th Dec 2019
Registration Number
UK00918170462 registered on
29th Sept 2020
Correspondent Information
Barker Brettell LLP
100 Hagley Road, Edgbaston
Birmingham,
B16 8QQ
Polishing slurry for semiconductors; polishing consumables, namely, polishing slurries, for use in the semiconductor, electronic, rigid disk and magnetic head industries; chemical mechanical polishing slurries used for the treatment of semiconductors to planarize, smooth, or otherwise modify their chemical-mechanical properties; polishing slurries used for the treatment of semiconductors to planarize, smooth or otherwise modify their mechanical, physical, chemical and electrical properties; chemical solutions for use in the manufacturing and processing of semiconductors, namely, photoresist stripper, benotriazole (bta), and l-proline solution; fumed silica dispensed in water used to polish semiconductors; aqueous metal oxide dispersions for use in semiconductor polishing; chemical additives, namely, abrasive dispersions for use in the manufacture of electronic components and substrates, optical components, metals, machinery, computer parts, and magnetic data-storage disks and heads; polishing slurry used in the manufacture of advanced integrated circuit devices within the semi-conductor industry; high purity chemical compositions for electronic component manufacture; chemical compositions for use in semiconductor manufacturing, solar cell panel manufacturing and flat panel display manufacturing; chemical compositions for removal of photoresist and post-etch residues in the manufacture of semiconductors, integrated circuits and related products; chemicals for use in industry and science; chemical products for use in industry and science, namely, for use in the semiconductor and micro-electronics industries; chemicals and chemical blends for use in the oil and gas drilling, processing and exploration industry; chemicals, namely, polymer-containing drag reducers and flow improvers to increase flow of hydrocarbons through pipelines; chemicals for use in industrial wood treating applications; chemicals for use in treating utility poles and cross-arms; Chemical mechanical polishing (cmp) slurry and chemical mechanical planarization (cmp) slurry for use in the manufacturing and processing of semiconductors in the optoelectronics and photonics industries; Chemical mechanical polishing slurry for use in polishing or smoothing the surface of flat panel displays, electronic components, glass and hard disk drive components; chemical cleaner for use in electronics industry; post-copper chemical mechanical planarization (cmp) cleaning solution for use in the manufacturing and processing of semiconductors; pad cleaning solution for use in the manufacturing and processing of semiconductors; abrasive preparations, namely, chemical cleaners, namely, abrasive dispersion slurries and cleaning and polishing preparations for use in the finishing of electronic components and substrates, optical components, glass, metals, plastics, machinery, computer parts, magnetic data-storage disks and heads; Sealants (chemicals) for the sealing of surfaces; Sealants (chemicals) for the sealing of surfaces for the oil and gas storage, pipeline and gas distribution markets.
Abrasive compounds for lapping and polishing semiconductors, silicon wafers, glass and metal surfaces; cleaning solution for processing of integrated circuit (ic) in the opto-electronics and photonics industries; post-ash cleaning solution for use in the manufacturing and processing of semiconductors.
Valve lubricants for the oil and gas storage, pipeline and gas distribution markets; industrial lubricants, namely lubricating oils and greases.
Herbicide.
Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads (parts of machines) for use in the manufacture of advanced integrated circuit devices within the semiconductor industry; lubrication equipment used to service industrial valves in the oil and gas, chemical, and oilfield/wellhead industries and to service industrial gas distribution systems.
Valve sealant for the oil and gas storage, pipeline and gas distribution markets; ndustrial sealants, namely silicone sealants and waterproof sealants, pipe-joint sealant, pipe-joint sealant for the oil and gas storage, pipeline and gas distribution markets.
Leasing of oil and gas drilling equipment.
UK00918170462
Word
Individual