Classification Information
Class [9]
Computer & Software Products & Electrical & Scientific Products
Semiconductor device; semiconductor chips; integrated circuits; integrated circuit chips; integrated circuit module; integrated circuit package; IC (integrated circuit); IC chips; IC module; IC package; semiconductor memory; dynamic random access memory; semiconductor memory module; dynamic random access memory module; wafer level package; semiconductor element; electronic circuits; large scale integrated circuits; integrated circuit wafer; semiconductor wafer; IC (integrated circuit) memories; floppy disks, disks, CD-ROM, memory chips, tapes and other recording media recorded with computer programs for database relating to processing facility, processing equipment and processing technology of semiconductor chips; magnetic drum, magnetic disks, magnetic tapes, CD-ROM, electronic circuits and other recording media recorded with computer programs for development and designing of semiconductor element, integrated circuits and electronic circuits; recording media recorded with application software for designing of processing technology, processing device and electric circuit modeling of integrated circuits; computer software for designing and establishing database of processing facility of semiconductor chips; computer software for designing and establishing database of designing device and processing technology of integrated circuits; computer software for designing of integrated circuits.
Class [40]
Treatment & Processing of Materials Services
Assembling of semiconductor device and semiconductor device package; manufacturing and assembling of IC and package; manufacturing and assembling of semiconductor device and integrated circuits; manufacturing and assembling of wafer level package; manufacturing and assembling of semi-conductors, memory chips, wafer, wafer level package and integrated circuits for others; manufacturing and assembling of semi-conductors and integrated circuits for others; manufacturing and assembling of electronic machines, apparatus and their parts; manufacturing and assembling of semiconductor element for others; manufacturing and assembling of semi-conductors for others; manufacturing and assembling of semiconductor wafer for others; manufacturing and assembling of integrated circuits for others; assembling or packing (packaging, implementing or mounting) in relation to semiconductor device or integrated circuits; providing information about processing semiconductors; providing information about processing semiconductor element; providing information about processing integrated circuits; providing information about manufacturing semiconductor wafer.
Class [42]
Computer & Software Services & Scientific Services
Designing of semiconductor device package; designing of IC package; designing of semiconductor element, semiconductor and device, integrated circuits, semiconductor memory, dynamic random access memory, semiconductor device package, IC package and wafer level package; testing, inspection or research on semiconductor element, semiconductor device, integrated circuits, semiconductor memory, dynamic random access memory, semiconductor device package, IC package and wafer level package; designing about integrated circuits; designing of semi-conductors, semiconductor element and integrated circuits; providing computer programs for designing of processing technology, processing device and electric circuit modeling of integrated circuits via Internet; providing information about design and development of semiconductor integrated circuits; providing information about inspection on semi-conductors; providing information about designing of semi-conductors; advisory and consultancy services relating to designing of integrated circuits; research, development and designing of semiconductor element, integrated circuits and electronic circuits; advisory, consultancy and information services relating to research, development and designing of semiconductor element, integrated circuits and electronic circuits.
