Classification Information
Class [7]
Machinery Products
Machine tools; Metal working machinery and appliances; Semiconductor manufacturing machines and systems; Machines for dicing semiconductor wafers into chips by means of blade, by means of laser, or by other means; Grinding machines, in particular for use in semiconductor manufacturing process; UV irradiation machines, electron beam irradiation machines, and other energy line irradiation machines, all being for use in semiconductor manufacturing process; Machines for adhering surface protection tapes, machines for adhering backside protection tape, both being for use in semiconductor manufacturing process; Machines for releasing surface protection tape, machines for releasing backside protection tape, both being for use in semiconductor manufacturing process; Machines for issuing and adhering, and for writing bar code label and radio frequency identification (RFID) label, all being for use in semiconductor manufacturing process; Metal working machinery and appliances made up of cutting machines for semiconductor wafers and the like, tape adhering machines, grinding machines, transporting machines, tape replacing machines; Semiconductor wafer processing machines and parts thereof; Semiconductor wafer washing machines; Feeding machines; transferring machines; Feeding machines, transferring machines, and storing machines, all for semiconductor wafers; Machines for exchanging wafers among semiconductor wafer containers; Heating machines, pressurizing machines for processing semiconductor wafers; Frames for use in semiconductor wafer processing steps [fitting and auxiliary parts for wafers]; Storing containers, transferring containers, and transporting containers, all for use with frames to be used in processing semiconductor wafers; Storing containers, transferring containers, and transporting containers, all for use in processing semiconductor wafers [auxiliary and ancillary parts of semiconductor wafer processing equipment]; Cutting machines, and punching machines, both particularly being for use in semiconductor wafer processing tapes; Machines for picking up diced semiconductor chips; Printing/book making machines and appliances; Wrapping machines and appliances; Automatic labeling machines and appliances [other than for office use]; Labeling machines and appliances [other than for office use]; Label making machines [other than for office use]; Laminators [machines] other than for office use; Delaminators [machines] other than for office use; Tape laminators and tape removers [machines]; Bar code labelers.
Class [9]
Computer & Software Products & Electrical & Scientific Products
Data processing equipment, computers; peripherals adapted for use with computers; Bar code printers; Bar code readers; Label readers (decoder); Thermal transfer printers; Laser printers; Ink jet printers; Thermal printers; Printers; Programs for electronic calculators; Labels (encoded); Bar code labels, RFID labels; Bar code labels, RFID labels, both being for physical distribution management; Bar code labels, RFID labels, both being for production management; Machines for reading bar code label and radio frequency identification (RFID) label, all being for use in semiconductor manufacturing process.
Class [16]
Paper Goods and Printed Material
Paper, cardboard; printed matter; photographs; stationery; adhesives for stationery or household purposes; typewriters and office requisites (except furniture); instructional and teaching material (except apparatus); plastic materials for packaging (not included in other classes); printers' type; printing blocks; Addressing machines; Ink ribbons for printing; Case sealing machines for office use; Dust-free paper; Adhesive coated paper; Papers; Labels; Paper labels; Adhesive labels (not including those made of woven fabrics); Heat-sensitive adhesive labels; Heat-sensitive printing labels; Adhesive tapes for stationery use; Notebooks made of dust-free paper; Stationery products.
Class [17]
Rubber Products
Rubber, gum, mica; plastics in extruded form for use in manufacture; packing, stopping and insulating material; Plastic basic products, namely processed and semi-processed plastics material; Adhesive tapes and films; Adhesive tapes and films, for industrial purposes; Films and plastic sheets for commercial use, industrial use and agricultural use; Plastic films and plastic sheets; Laminated films and laminated sheets; Adhesive tapes for processing semiconductor wafers; Films used for manufacturing electronic circuits; Plastic films coated with adhesives, with pressure-sensitive adhesives, and with adhesives/pressure-sensitive adhesives; Adhesive tapes, pressure-sensitive adhesive tapes, adhesive tapes/pressure-sensitive adhesive tapes, all being for processing semiconductors; Adhesive tapes, pressure-sensitive adhesive tapes, adhesive tapes/pressure-sensitive adhesive tapes, all being for holding in position semiconductors; Processing tapes for processing semiconductor wafers; Release tapes for releasing processing tapes for processing semiconductor wafers; Adhesive tapes for surface-mounting/laminating semiconductor chips; Heat-sensitive and pressure-sensitive adhesive tapes/heat-sensitive adhesive tapes for use in manufacturing processes of electronic parts such as semiconductor wafers, ceramic capacitors, etc; Protection tapes for protecting rear surfaces of semiconductor chips.
