Magnetic tapes, magnetic sheets, floppy disks; reels and cassettes and cartridges, all for magnetic tapes; demagnetising apparatus for tape recorder heads; rotary magnetic recording disks; parts and fittings included in Class 9 for electric and electronic apparatus and instruments; high frequency magnetic apparatus; electrodes included in Class 9; microwave absorbing apparatus and electromagnetic shields, other than insulators or insulating materials; magnetic cores, magnets; memories for computers; pulse transformers.

Electrical instruments and apparatus included in Class 9; computers and calculating machines; magnetic tapes, and reels, cartridges and cassettes for use therewith; and parts and fittings included in Class 9 for all such goods; magnets; ferrite cores and iron cores, all included in Class 9.

Instruments, apparatus, necklaces and bracelets, all for medical, surgical or curative purposes; and parts and fittings included in Class 10 for all the aforesaid goods

Machines for automatically inserting electronic components into printed electric circuit boards; machine for manufacturing electric components; machine for automatically winding magnetic tapes; rotary presses (machines); wire forming machines; painting machines; printing machines (not for office use); and parts and fittings included in Class 7 for all the aforesaid goods.

Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signaling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; compact discs, DVDs and other digital recording media; mechanisms for coin-operated apparatus; cash registers, calculating machines, data processing equipment, computers; computer software; fire-extinguishing apparatus; electric/electronic components; electric/electronic passive components; electric/electronic devices, electric/electronic materials, namely, ceramic components, microwave ceramics, capacitors, ceramic capacitors, multilayer ceramic capacitors, electric double-layer capacitors, reactors, power factor controllers, assembled elements composed of capacitors, EMC (electromagnetic compatibility) components, ferrite beads, ceramic beads, chip beads, electrical/electronic filters, filters for electrical signals, filters to control signal frequencies, filters for radio interference suppression, EMC (electromagnetic compatibility) filters, 3-terminal filters, common mode filters, chokes, choke coils, common mode choke coils, noise absorbers, power line chokes, differential mode choke coils, peaking coils, molded coils, transponder coils, varistors, arresters, clamp filters (ferrite core with case), ferrites, ferrite materials, ferrite cores, dielectric filters, ceramic filters, piezoelectric filters, ferrite beads filters, noise filters, inductors, coils, transformers, electrical/electronic transformers, pulse transformers, current transformers, noise suppressing sheets, magnetic sheets, electromagnetic absorbing and shielding materials, micro wave absorbers, electromagnetic absorbers, radio wave absorbers, high frequency magnetic substances, anechoic chambers, equipment/devices for EMC (electromagnetic compatibility) test system, sold individually or in units, sensors, electric/electronic sensors, angular rate measurement sensors, angle measurement sensors, pressure measurement sensors, current measurement sensors, distance measurement sensors, position measurement sensor, torque measurement sensor, temperature measurement sensors, thermistors, NTC (negative temperature coefficient) thermistors, PTC (positive temperature coefficient) thermistors, temperature responsive reed switches, humidity sensors, surface potential sensors, gear tooth sensors, gear tooth sensors for angle sensing, gear tooth sensors for speed sensing, mechanical sensors, toner concentration/residual volume sensors, powder level sensors, door open/shut sensors, switches for door latch, electromagnetic sensors, actuators, plungers, plungers [part of machines], mechanical drive components, nebulizers, nebulizer units, ultrasonic nebulizer units, humidifier for mist generation system, pumps, piezoelectric components, piezoelectric products, piezoelectric ceramic filters, resonators, resonant circuits, ceramic resonators, sounding bodies, piezoelectric receivers, piezoelectric buzzers, electromagnetic buzzers, piezoelectric actuators, magnetostrictive resonators, discriminators, ceramic discriminators, thermal print heads, thin film thermal heads, recording/reproducing heads, magnetic heads, thin film magnetic heads, memory controllers, non-volatile memory controllers, flash memory controllers, NAND flash memory controllers, flash memory, memory cards, flash memory cards, non-volatile memory, non-volatile memory cards, CF (compact flash) cards, CF (compact flash) card for industrial applications, SSD (solid state drive), SSD (solid state drive) for industrial applications, semiconductor devices, semiconductor memories, memory card adapters, displays, organic light emitting displays, light emitting diodes, organic light emitting diodes, RF (radio frequency) components, antennas, ceramic patch antennas, ceramic chip antennas, multilayer chip antennas, band pass filters, dielectric band pass filters, circulators, circulators for base stations, isolators, isolators for base stations, multiplexers, diplexers, multilayer diplexers, triplexers, multilayer band pass filters, thin-film band pass filters, phase shifters, multilayer phase shifters, delay lines, strip lines, low pass filters, multilayer low pass filters, high pass filters, multilayer high pass filters, baluns, balun transformers, multilayer balun transformers, thin film balun transformers, couplers, directional couplers, multilayer directional couplers, LAN (local area network) components, wireless LAN (local area network) modules, devices for wireless radio transmission, wireless telephony apparatus, electric/electronic resisters, double balance mixers, terminators, transducers, accelerometers, electrodes, magnets, ferrite magnets, plastic bonded magnets, rubber bonded magnets, magnets sheets, magnetic cores, magnetic materials, power supplies, AC (alternate current) input power supplies, DC (direct current) to DC (direct current) converters, DC (direct current) to AC (alternate current) inverters, switching power supplies, UPS (uninterruptible power systems), solar cells, film solar cells, inverters, inverter ballasts, fluorescent lamp ballast for electric lights, converters, factory automation systems, wafer processing equipment, semiconductor manufacturing equipment, FOUP Load Port (station for supporting a semiconductor wafer transporting container where the cover of the transporting container is separated or separable from the transporting container), flip chip mounting machine, flip chip dispensers, component inserting machines, bulk feeding machines, components sequencing machines, laser marking systems, chip component mounting machines, blades [part of machines], IC (integrated circuits), circuit boards, IC (integrated circuits) boards, batteries, ITO (Indium-Tin-Oxide) film, conductive film, ITO Transparent Conductive Film, ITO (Indium-Tin-Oxide) plates, Conductive plates, ITO Transparent Conductive plates, blank magnetic tapes, blank magnetic discs, blank magnetic optical disks, blank optical disks, SAW (Surface Acoustic Wave) components, SAW (Surface Acoustic Wave) filters, SAW (Surface Acoustic Wave) resonators, duplexers, RF (radio frequency) modules, SAW (surface acoustic wave) modules, SAW (surface acoustic wave) fronted modules, diodes, arrestors, surge arrestors, surge voltage arrestors, ceramic switching components, ceramic heating components, high-voltage contactors switching spark gaps, conversion filters, power capacitors, tantalum chip capacitors, aluminum electrolytic capacitors, ultra capacitors, inductive ferrite components, film capacitors, polymer chip capacitors, accessories for ferrites, SMT (surface mount technology) inductive resistors, SMT (surface mount technology) power inductive resistors, repeating coils, filters for shielded rooms, EMC (electromagnetic compatibility) feedthrough components, metal oxide varistors, ceramic semiconductors, microwave band pass filters, microwave resonators, microwave ceramic components, dielectric ceramic filters, high-frequency modules, microwave modules, LTCC (low-temperature co-fired ceramics) modules, surface wave components, volume wave components, dielectric materials, materials for electrodes, BAW (bulk acoustic wave) components, FBAR (film bulk acoustic wave) components, MEMS (micro electro mechanical Systems) components, MEMS (micro electro mechanical systems) sensors, MEMS (micro electro mechanical systems) microphones, electronic circuit modules, H-ML (high-frequency multilayer) devices, ESD (electro-static discharge) components, EMI (electro-magnetic interference) components, optical components, PLC (planar lightwave circuits), TOSA (transmitter optical subassembly), ROSA (receiver optical subassembly), optical sensors, visible radiant optical sensors, optical attenuators, optical couplers, optical splitters, optical filters, optical switches, optical isolators, optical circulators, optical modulators, optical connectors, optical multiplexers, optical demultiplexers, optical transceivers, photo diodes, optical sensor modules, visible radiant optical sensor modules, optical attenuator modules, optical coupler modules, optical splitter modules, optical filter modules, optical switch modules, optical isolator modules, optical circulator modules, faraday rotator modules, optical modulator modules, optical connector modules, optical multiplexer modules, optical demultiplexer modules, optical transceiver modules, photo diode modules, optical sensor assemblies, visible radiant optical sensor assemblies, optical attenuator assemblies, optical coupler assemblies, optical splitter assemblies, optical filter assemblies, optical switch assemblies, optical isolator assemblies, optical circulator assemblies, faraday rotator assemblies, optical modulator assemblies, optical connector assemblies, optical multiplexer assemblies, optical demultiplexer assemblies, optical transceiver assemblies, photo diode assemblies, transmitter optical subassemblies, receiver optical subassemblies, faraday rotators, piezoelectric devices multilayer varistors, multilayer NTC (negative temperature coefficient) thermistors, Magnetic heads and parts and components thereof, including, head sliders, head gimbal assemblies (HGA), head arm assemblies (HAA), head stack assemblies (HSA), and/or head coil assemblies(HCA), Magnetic sensors, magnetic encoders, magnetic scale, thin-film actuators, thermal heads, VTR heads, tape heads, Finger Navigation module, lightpeak, spindle motors, voice coil motors, disk drives for computers, optical data media, disk drive components, electronic integrated circuits, semiconductor chips, semiconductors, MRAM (Magnetoresistive Random Access Memory), biosensor, suspensions and parts and components thereof, including flexures, load beams, base plates, hinges, and/or traces, computer disk drive suspensions, magnetic disk drive suspensions, rechargeable batteries, lithium-ion batteries, rechargeable lithium-ion polymer batteries, optical image stabilization module, optical image stabilization device, optical image stabilization actuator, electrical/electronic circuit, computer programs, hall switches, linear hall sensors, wireless vital data monitoring sensors, portable vital data monitoring devices with sensors to monitor the vital signs, body temperatures or physical movements of persons wearing or carrying the devices and transmit these data to smart-phones or tablet computers, wireless power transfer units and modules; parts and fittings for all of the aforesaid goods.

The services of engineers and scientists who undertake evaluations, estimates, research and reports in the scientific and technological fields (including technological consultancy); computer and technology services for securing computer data and personal and financial information and for the detection of unauthorized access to data and information; scientific research services for medical purposes; product testing, namely, testing electronic products for electromagnetic emissions and immunity from electromagnetic interferences; engineering consultation, evaluation and electrical product design and development for others of electronic goods relating to the electromagnetic emissions and immunity from electromagnetic interference of electronic goods; measuring and evaluating over-the-air signals of mobile terminals that emit RF signals; development and design of sensor systems for remote process control, for monitoring, system control, diagnostics and error reporting; design, development and maintenance of computer software.

Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signaling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; compact discs, DVDs and other digital recording media; mechanisms for coin-operated apparatus; cash registers, calculating machines, data processing equipment, computers; computer software; fire-extinguishing apparatus; electric/electronic components; electric/electronic passive components; electric/electronic devices, electric/electronic materials, namely, ceramic components, microwave ceramics, capacitors, ceramic capacitors, multilayer ceramic capacitors, electric double-layer capacitors, reactors, power factor controllers, assembled elements composed of capacitors, EMC (electromagnetic compatibility) components, ferrite beads, ceramic beads, chip beads, electrical/electronic filters, filters for electrical signals, filters to control signal frequencies, filters for radio interference suppression, EMC (electromagnetic compatibility) filters, 3-terminal filters, common mode filters, chokes, choke coils, common mode choke coils, noise absorbers, power line chokes, differential mode choke coils, peaking coils, molded coils, transponder coils, varistors, arresters, clamp filters (ferrite core with case), ferrites, ferrite materials, ferrite cores, dielectric filters, ceramic filters, piezoelectric filters, ferrite beads filters, noise filters, inductors, coils, transformers, electrical/electronic transformers, pulse transformers, current transformers, noise suppressing sheets, magnetic sheets, electromagnetic absorbing and shielding materials, micro wave absorbers, electromagnetic absorbers, radio wave absorbers, high frequency magnetic substances, anechoic chambers, equipment/devices for EMC (electromagnetic compatibility) test system, sold individually or in units, sensors, electric/electronic sensors, angular rate measurement sensors, angle measurement sensors, pressure measurement sensors, current measurement sensors, distance measurement sensors, position measurement sensor, torque measurement sensor, temperature measurement sensors, thermistors, NTC (negative temperature coefficient) thermistors, PTC (positive temperature coefficient) thermistors, temperature responsive reed switches, humidity sensors, surface potential sensors, gear tooth sensors, gear tooth sensors for angle sensing, gear tooth sensors for speed sensing, mechanical sensors, toner concentration/residual volume sensors, powder level sensors, door open/shut sensors, switches for door latch, electromagnetic sensors, actuators, plungers, plungers [part of machines], mechanical drive components, nebulizers, nebulizer units, ultrasonic nebulizer units, humidifier for mist generation system, pumps, piezoelectric components, piezoelectric products, piezoelectric ceramic filters, resonators, resonant circuits, ceramic resonators, sounding bodies, piezoelectric receivers, piezoelectric buzzers, electromagnetic buzzers, piezoelectric actuators, magnetostrictive resonators, discriminators, ceramic discriminators, thermal print heads, thin film thermal heads, recording/reproducing heads, magnetic heads, thin film magnetic heads, memory controllers, non-volatile memory controllers, flash memory controllers, NAND flash memory controllers, flash memory, memory cards, flash memory cards, non-volatile memory, non-volatile memory cards, CF (compact flash) cards, CF (compact flash) card for industrial applications, SSD (solid state drive), SSD (solid state drive) for industrial applications, semiconductor devices, semiconductor memories, memory card adapters, displays, organic light emitting displays, light emitting diodes, organic light emitting diodes, RF (radio frequency) components, antennas, ceramic patch antennas, ceramic chip antennas, multilayer chip antennas, band pass filters, dielectric band pass filters, circulators, circulators for base stations, isolators, isolators for base stations, multiplexers, diplexers, multilayer diplexers, triplexers, multilayer band pass filters, thin-film band pass filters, phase shifters, multilayer phase shifters, delay lines, strip lines, low pass filters, multilayer low pass filters, high pass filters, multilayer high pass filters, baluns, balun transformers, multilayer balun transformers, thin film balun transformers, couplers, directional couplers, multilayer directional couplers, LAN (local area network) components, wireless LAN (local area network) modules, devices for wireless radio transmission, wireless telephony apparatus, electric/electronic resisters, double balance mixers, terminators, transducers, accelerometers, electrodes, magnets, ferrite magnets, plastic bonded magnets, rubber bonded magnets, magnets sheets, magnetic cores, magnetic materials, power supplies, AC (alternate current) input power supplies, DC (direct current) to DC (direct current) converters, DC (direct current) to AC (alternate current) inverters, switching power supplies, UPS (uninterruptible power systems), solar cells, film solar cells, inverters, inverter ballasts, fluorescent lamp ballast for electric lights, converters, factory automation systems, wafer processing equipment, semiconductor manufacturing equipment, FOUP Load Port (station for supporting a semiconductor wafer transporting container where the cover of the transporting container is separated or separable from the transporting container), flip chip mounting machine, flip chip dispensers, component inserting machines, bulk feeding machines, components sequencing machines, laser marking systems, chip component mounting machines, blades [part of machines], IC (integrated circuits), circuit boards, IC (integrated circuits) boards, batteries, ITO (Indium-Tin-Oxide) film, conductive film, ITO Transparent Conductive Film, ITO (Indium-Tin-Oxide) plates, Conductive plates, ITO Transparent Conductive plates, blank magnetic tapes, blank magnetic discs, blank magnetic optical disks, blank optical disks, SAW (Surface Acoustic Wave) components, SAW (Surface Acoustic Wave) filters, SAW (Surface Acoustic Wave) resonators, duplexers, RF (radio frequency) modules, SAW (surface acoustic wave) modules, SAW (surface acoustic wave) fronted modules, diodes, arrestors, surge arrestors, surge voltage arrestors, ceramic switching components, ceramic heating components, high-voltage contactors switching spark gaps, conversion filters, power capacitors, tantalum chip capacitors, aluminum electrolytic capacitors, ultra capacitors, inductive ferrite components, film capacitors, polymer chip capacitors, accessories for ferrites, SMT (surface mount technology) inductive resistors, SMT (surface mount technology) power inductive resistors, repeating coils, filters for shielded rooms, EMC (electromagnetic compatibility) feedthrough components, metal oxide varistors, ceramic semiconductors, microwave band pass filters, microwave resonators, microwave ceramic components, dielectric ceramic filters, high-frequency modules, microwave modules, LTCC (low-temperature co-fired ceramics) modules, surface wave components, volume wave components, dielectric materials, materials for electrodes, BAW (bulk acoustic wave) components, FBAR (film bulk acoustic wave) components, MEMS (micro electro mechanical Systems) components, MEMS (micro electro mechanical systems) sensors, MEMS (micro electro mechanical systems) microphones, electronic circuit modules, H-ML (high-frequency multilayer) devices, ESD (electro-static discharge) components, EMI (electro-magnetic interference) components, optical components, PLC (planar lightwave circuits), TOSA (transmitter optical subassembly), ROSA (receiver optical subassembly), optical sensors, visible radiant optical sensors, optical attenuators, optical couplers, optical splitters, optical filters, optical switches, optical isolators, optical circulators, optical modulators, optical connectors, optical multiplexers, optical demultiplexers, optical transceivers, photo diodes, optical sensor modules, visible radiant optical sensor modules, optical attenuator modules, optical coupler modules, optical splitter modules, optical filter modules, optical switch modules, optical isolator modules, optical circulator modules, faraday rotator modules, optical modulator modules, optical connector modules, optical multiplexer modules, optical demultiplexer modules, optical transceiver modules, photo diode modules, optical sensor assemblies, visible radiant optical sensor assemblies, optical attenuator assemblies, optical coupler assemblies, optical splitter assemblies, optical filter assemblies, optical switch assemblies, optical isolator assemblies, optical circulator assemblies, faraday rotator assemblies, optical modulator assemblies, optical connector assemblies, optical multiplexer assemblies, optical demultiplexer assemblies, optical transceiver assemblies, photo diode assemblies, transmitter optical subassemblies, receiver optical subassemblies, faraday rotators, piezoelectric devices multilayer varistors, multilayer NTC (negative temperature coefficient) thermistors, Magnetic heads and parts and components thereof, including, head sliders, head gimbal assemblies (HGA), head arm assemblies (HAA), head stack assemblies (HSA), and/or head coil assemblies(HCA), Magnetic sensors, magnetic encoders, magnetic scale, thin-film actuators, thermal heads, VTR heads, tape heads, Finger Navigation module, lightpeak, spindle motors, voice coil motors, disk drives for computers, optical data media, disk drive components, electronic integrated circuits, semiconductor chips, semiconductors, MRAM (Magnetoresistive Random Access Memory), biosensor, suspensions and parts and components thereof, including flexures, load beams, base plates, hinges, and/or traces, computer disk drive suspensions, magnetic disk drive suspensions, rechargeable batteries, lithium-ion batteries, rechargeable lithium-ion polymer batteries, optical image stabilization module, optical image stabilization device, optical image stabilization actuator, electrical/electronic circuit, computer programs, hall switches, linear hall sensors, wireless vital data monitoring sensors, portable vital data monitoring devices with sensors to monitor the vital signs, body temperatures or physical movements of persons wearing or carrying the devices and transmit these data to smart-phones or tablet computers, wireless power transfer units and modules; parts and fittings for all of the aforesaid goods.

The services of engineers and scientists who undertake evaluations, estimates, research and reports in the scientific and technological fields (including technological consultancy); computer and technology services for securing computer data and personal and financial information and for the detection of unauthorized access to data and information; scientific research services for medical purposes; product testing, namely, testing electronic products for electromagnetic emissions and immunity from electromagnetic interferences; engineering consultation, evaluation and electrical product design and development for others of electronic goods relating to the electromagnetic emissions and immunity from electromagnetic interference of electronic goods; measuring and evaluating over-the-air signals of mobile terminals that emit RF signals; development and design of sensor systems for remote process control, for monitoring, system control, diagnostics and error reporting; design, development and maintenance of computer software.

Burgers;French fries.

Ice cream desserts.

Audio tapes, video tapes, floppy discs; parts and fittings for all the aforesaidgoods; all included in Class 9.

Scientific, research, navigation, surveying, photographic, cinematographic, audiovisual, optical, weighing, measuring, signalling, detecting, testing, inspecting, life-saving and teaching apparatus and instruments; Apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling the distribution or use of electricity; Apparatus and instruments for recording, transmitting, reproducing or processing sound, images or data; Recorded and downloadable media, computer software, blank digital or analogue recording and storage media; Mechanisms for coin-operated apparatus; Cash registers, calculating devices; Computers and computer peripheral devices; Inertial measurement unit; motion sensors; accelerometers; gyroscopes; magnetometers; pressure sensors; temperature sensors; ultrasonic sensors for measuring acceleration, angle of rotation, pressure, temperature, and distance ranges, all for use in automotive systems, autonomous car systems, advanced driver assisted systems, internet of things applications, and internet of things software development systems; measuring equipment (sensors) comprising an inertial measurement unit, magnetometer, pressure sensor, temperature sensor, ultrasonic sensor, passive components, and high-precision algorithms, all for use in sensor fusion for automotive systems, autonomous car systems, advanced driver assisted systems, internet of things applications, and internet of things software development systems; sensor development kits, namely, kits comprised primarily of computer hardware and downloadable software for use in developing and operating sensors and electronic devices for detecting, transmitting, recognizing, analyzing, and tracking motion, movement, positions, distances, obstacles, ultrasonic signals, and ultrasonic range sensing; downloadable computer software for integrating drivers for multi-sensor modules for automotive systems, autonomous car systems, advanced driver assisted systems, internet of things software development systems, and internet of applications things.

Capacitors, inductors (coils); EMC (electromagnetic compatibility) components; RF/SAW (radio frequency/surface acoustic wave) components and modules; voltage protection devices; current protection devices; temperature protection devices; sensors and sensor systems; ceramic switching/heating; piezo components and buzzers; transformers; ferrites; ferrite cores, beads, rings, rods, sleeves and tiles, being electronic components; noise suppressing magnetic sheets; anechoic chambers and radio wave absorbers; power supplies; magnets; flash storages; wireless battery chargers; FA (factory automation) systems; ITO (indium tin oxide) transparent conductive film; micro modules (substrates with built-in ICs (integrated circuits)); HDD (hard disk drive) head; lithium polymer batteries; solar cells; semiconductor embedded in substrate; circuit boards; printed circuit boards; electronic circuit boards; integrated circuit boards; semiconductor boards; circuit embedded boards; printed circuit embedded boards; electronic circuit embedded boards; integrated circuit embedded boards; semiconductor embedded boards; passive component embedded boards; circuit substrates; printed circuit substrates; electronic circuit substrates; integrated circuit substrates; semiconductor substrates; circuit embedded substrates; printed circuit embedded substrates; electronic circuit embedded substrates; integrated circuit embedded substrates; semiconductor embedded substrates; passive component embedded substrates; circuit modules; printed circuit modules; electronic circuit modules; integrated circuit modules; electronic circuit cards; integrated circuit cards; electronic circuit packages; integrated circuit packages; parts and fittings for electric and electronic apparatus, namely, modules incorporated into radio frequency circuits, electrical power supplies, integrated circuits and capacitors; semiconductors; electronic integrated circuits; integrated circuits; large scale integrated circuits; printed circuits; capacitors; multilayer ceramic capacitors; ceramic capacitors; super low distortion multilayer capacitors; variable capacitors; high voltage capacitors; monolithic ceramic capacitors; double layer capacitors; trimmer capacitors; electric resistors; transistors; Lithium-ion batteries; Solid-State Batteries; Biosensors; Computer software for processing vital data; Wireless vital data monitoring sensors; IC chips for wireless vital data monitoring sensors; Portable vital data monitoring devices with sensors to monitor the vital signs, body temperatures or physical movements of persons wearing or carrying the devices and transmit these data to smartphones or tablet computers (excluding those for medical use); IC chips for portable vital data monitoring devices; Computer software for portable vital data monitoring devices; Transparent Conductive Film; Transparent Conductive plates; solar cells; film solar cells.